In late November 2022, Linksee Semiconductor Technology (Suzhou) Co., Ltd. successfully completed a new round of Series A financing. Marking the company's second strategic financing since inception, this round brought the total funds raised to nearly RMB 100 million. The funding was led by Suzhou Join Hands Capital, a subsidiary of Lenovo Holdings, alongside contributions from Suzhou High-tech Financial Holding Group. The capital acquired will primarily be used for in-house chip research and development, talent acquisition, and large-scale production.
Established in March 2020, Linksee is an innovative design enterprise that specializes in the R&D of high-performance analog and digital mixed-signal reconfigurable devices. Our products cater predominantly to the consumer electronics, IoT, and automotive markets.
We boast industry-leading expertise in developing high-precision analog-digital mixed products. Furthermore, the R&D team's creations have been deployed widely across sectors such as consumer, industrial, and automotive, amassing global shipments exceeding 3 billion units and serving numerous top-tier global companies. Linksee's on-site reconfigurable technology fills a void in the domestic market and has propelled our company into a select group worldwide that possess this technology. To date, we have earned 3 integrated circuit layout design patents, 2 utility model patents, and 1 software copyright.
As required by our clients, the field reconfigurable technology allows for the adjustment of the internal connections and functions of the chip at any stage - R&D or mass production - according to customer requirements, using a code-free mode. This flexibility facilitates the rapid and efficient realization of customer requirements and problem resolution. Drawing on this technology and micro-mechanical technology, we offer our customers a range of products including standard discrete devices, gas sensors, field reconfigurable devices, and customized ASICs. With a focus on various application scenarios, we are committed to resolving clients' application challenges and collaboratively develop future-oriented chips.